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  hsmp-389z rf switching pin diodes in surface mount sod-323 package data sheet features ? 2 leads surface mount package ? switching - low capacitance - low resistance at low current ? tape and reel options available ? low failure in time (fit) rate ? msl 1 & lead free description/applications avago technologiess hsmp-389z is optimized for switching applications where low resistance at low current and low capacitance are required. it is housed in a low cost, industrial standard surface mount package - sod-323. this package offers customers who already use them in sot-23 and sot-323 packages, a logical transition to a smaller package outline to accommodate end product design with limited board space. a spice model is not available for pin diodes as spice does not provide for a key pin diode characteristic -- carrier lifetime. package marking and pin connections note: package marking provides orientation and identification e = device code ? = month code indicates the month of manufacture e? cathode anode
2 table 1. absolute maximum ratings [1] at tc = +25c table 2. electrical specifications at tc = +25c table 3. typical parameters at tc = +25c notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. thermal resistance is measured from junction to board using ir method. symbol parameter unit max rating i f forward current (1 s pulse) amp 1 p iv peak inverse voltage v 100 t j junction temperature 0 c150 t stg storage temperature 0 c -60 to 150 jb thermal resistance [2] 0 c/w 135 minimum breakdown voltage v br (v) maximum total resistance r s (ohm) maximum total capacitance c t (pf) 100 2.5 0.30 test conditions v r = v br measure i r 10ua i f = 5ma f = 100 mhz v r = 5v f = 1mhz series resistance r s (ohm) carrier lifetime (ns) total cap aci t anc e c t (pf) 3.8 200 0.20 test con di t io ns i f = 1 ma f = 100 mhz i f = 10ma i r = 6ma v r = 5v f = 1mhz note : rs parameter is tested under aql 1.0
3 typical performance curves at tc = +25c figure 1. rf resistance vs. forward bias current figure 2. forward current vs. forward voltage figure 3. rf capacitance vs. reverse bias figure 4. 2nd harmonic input intercept point vs. diode rf resistance figure 5. typical reverse recovery time vs. reverse voltage 0 1 10 100 0.01 0.10 1.00 10.00 100.00 forward current (ma) rf resistance (ohms) 0.01 0.10 1.00 10.00 100.00 0 0.2 0.4 0.6 0.8 1.0 1.2 forward voltage (v) forward current (ma) +125?c +25?c -50?c 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 02468101214161820 reverse voltage (v) total capacitance (pf) 1 mhz 30 mhz 120 115 110 105 100 95 90 85 11 0 30 i f - forward bias current (ma) input intercept point (dbm) diode mounted as a series attenuator in a tested at 123 mhz 50 ohm microstrip and 200 160 120 80 40 0 10 20 15 25 30 t rr - reverse recovery time (ns) forward current (ma) v r = -2 v v r v r = -5 v = -10 v
4 user feed direction cover tape carrier tape reel dim millimeters a b c d e f g h j k 2.50 0.2 1.25 0.05 0.90 0.05 0.30+0.06/-0.04 1.70 0.05 min 0.17 0.126 0.03 0~0.1 0.15 0.05 0.4 2 +4/-2 l m4 ~6 i 1.0 max cathode mark m m i c j g d 2 1 b e k a f h l + _ + _ + _ + _ + _ + _ package outline and dimension pcb footprint device orientation 2.3 0.8 0.9 dimension in mm note: ?e ? represents package marking code ?? ? represents date code e? 4 mm top view end view e? e? e? e? e? e? e? e? e? e? e? e? e? e? e? 8 mm
5 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. obsoletes av01-0124en av01-0183en - may 18 , 2006 part number ordering information part number no. of units container HSMP-389Z-BLKG 100 anti-static bag hsmp-389z-tr1g 3000 7" reel tape dimensions specification < unit: mm > a. hole pitch : 50 pitch tolerance : 200 0.3


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